Photosensitive High-Temperature Peelable PSPI

Photosensitive peelable PSPI is a photosensitive temporary protection material for precision electronic processes such as PCB, substrates, and advanced semiconductor packaging. Exposure and development define designated selective protection and opening areas. The material provides local protection during subsequent high-temperature, lamination, or machining processes and is removed by alkaline stripping after processing.

Photosensitive peelable PSPI combines photosensitive patterning, resistance to high-temperature and lamination processes, and alkaline stripping after processing. It can form designated selective protection and opening areas according to the design and is suitable for cavities and recesses, step structures, gold fingers, resin-flow blocking at window openings, and other local temporary protection processes.

PSPI is first coated uniformly on the substrate surface, then patterned through photomask exposure and development to form local protection patterns.

This allows selective protection areas to be formed at cavities, local recesses, step structures, gold fingers, or other designated locations according to the product design, without manually cutting tape to create complex patterns.

Pattern dimensions and resolution can be optimized according to film thickness, exposure equipment, photomask design, and actual process requirements.

Yes. A typical lamination condition is 230°C, and the material can also accommodate higher-temperature processes. The applicable range can be evaluated according to process conditions such as temperature, pressure, time, and film thickness. After high-temperature or lamination processing, the protection layer can still be removed by alkaline stripping.

After processing, PSPI can be dissolved and removed through an alkaline stripping process.

The material is compatible with alkaline stripping equipment and process conditions commonly used by PCB and FPC manufacturers.

Representative test conditions include:

• 4% sodium hydroxide (NaOH)
• 50°C
• approximately 3–5 minutes

for complete removal.

These are representative process conditions rather than fixed requirements. The alkaline solution type, concentration, temperature, and treatment time can be adjusted according to the customer’s existing production line, film thickness, and prior thermal history.

In addition to sodium hydroxide (NaOH), potassium hydroxide (KOH) or other alkaline removal systems may be evaluated according to process requirements.

Microcosm can recommend suitable stripping parameters based on the customer’s existing stripping line and process conditions.

PI protection tape typically forms protection areas through application, cutting, or die cutting. Photosensitive peelable PSPI uses exposure and development to form multiple designated selective protection and opening areas in one process. For cavities and recesses, step structures, gold fingers, or multiple local protection locations, it reduces individual tape application, cutting, and alignment operations. After processing, PSPI is removed by alkaline stripping, whereas PI tape is typically removed by physical peeling.

Photosensitive peelable PSPI can be used in various PCB temporary protection processes, including:

• Temporary protection of cavity and recess structures
• Protection of step structures, gold fingers, and local areas
• PP/AD resin-flow blocking at window openings
• Selective protection during multi-material stacking and lamination
• Local protection for optical-module-related processes
• Protection against cutting or machining burrs
• Processes requiring protection-layer removal after high-temperature processing

Material and process matching can be further evaluated for different substrate materials, film thicknesses, pattern dimensions, and downstream process conditions.

A PCB cavity is a local recess or hollow region formed in a circuit board or package substrate. It can accommodate chips or embedded components or create a localized step structure.

Peelable PSPI can define cavity or recess locations requiring temporary protection. After lamination, machining, or high-temperature steps, it is dissolved and removed under the recommended alkaline conditions.

Yes.

Photosensitive peelable PSPI can be used for temporary protection of cavity and recess structures and PP/AD resin-flow blocking at window openings.

Because the material forms designated patterns through exposure and development, it can precisely define patterns according to window locations and protection areas. Compared with manually applied and cut tape, it is more suitable for protection requirements involving multiple areas, complex shapes, or high-accuracy alignment.

For evaluation, provide conditions such as cavity depth, window dimensions, target film thickness, lamination temperature, pressure, and time. Microcosm can assist with process setup.

Yes.

Photosensitive peelable PSPI can be used for selective temporary protection in semiconductor, substrate, and package-substrate processes.

The material forms designated protection areas through exposure and development and provides local protection during subsequent high-temperature, lamination, or multi-material stacking processes. After processing, the protection layer is removed with an alkaline stripping solution.

It is therefore suitable for processes requiring:

• Fine-pattern protection
• Local Window Opening
• Selective protection of multiple areas
• Removal after high-temperature or lamination processing
• Integration with existing wet processes

in semiconductor, substrate, and package-substrate applications.

Microcosm can recommend suitable materials and process conditions based on the substrate structure, film thickness, thermal history, and downstream processes.

To support efficient material and process matching, please provide:

• Application and substrate type
• Protection location and structure
• Window / protection-area dimensions
• Target film thickness
• Maximum process temperature
• Lamination pressure and time
• Subsequent chemical or machining processes
• Intended PSPI removal stage
• Existing stripping equipment and alkaline conditions

Microcosm can recommend material selection, process settings, and stripping conditions based on this information to support integration into the customer’s existing process.