MPBV Liquid Photosensitive Build-up PI
Dedicated for Ultra Thin HDI, Glass Substrates & SAP Carriers
High-Precision Photosensitive PI Dielectric for Next-Generation HDI / SAP Technologies
High Resolution × High Thermal Resistance × High Reliability
Fully meeting the demands of fine-line circuitry and ultra-thin manufacturing processes
Photo-Definable MPBV Designed for Fine-Line Circuitryt
MPBV Liquid Photosensitive Build-Up PI (Microcosm Photosensitive Build-up PI Varnish) is a high-performance photosensitive polyimide material specifically developed for HDI (High Density Interconnect) and SAP (Semi-Additive Process) ultra-thin fabrication processes.
This material delivers high-resolution imaging capability, excellent adhesion strength, outstanding thermal stability, and superior chemical resistance. It is ideally suited for multilayer structures, fine-line circuits, bendable electronics, MEMS substrates, and other advanced electronic processes—meeting modern demands for high-density interconnection, miniaturization, lightweight design, and long-term reliability.
Common Challenges and Limitations
As electronic devices continue to evolve toward ultra-thin profiles, ultra-high density, bendability, and 3D stacking, substrate materials must meet increasingly stringent requirements:
- SAP / mSAP processes demand extremely high resolution (L/S 10/10 μm)
- Increasing HDI layer counts require thinner yet more heat-resistant build-up materials
- High-reliability electronics must pass 85°C / 85% RH / 1000 hr environmental testing
- Insufficient adhesion can lead to delamination and CAF failures
- Materials must withstand chemical solutions, etchants, and electroplating processes
MPBV was developed to comprehensively address these challenges.
Product Advantages
Product Type：SLY00-GM / SLB00-GM
| Feature | Description | Product Values |
|---|---|---|
| High-resolution imaging | 30μm resolution | Enables ultra-fine SAP / mSAP circuits and higher wiring density |
| High thermal resistance | >320°C PASS | Compatible with HDI high-temperature lamination, curing, and plating |
| Excellent adhesion | >0.5 kg/cm（Plated Cu / MPBV） | Reduces delamination risk and improves reliability |
| Strong chemical resistance | Acid / alkali / wet-process resistant | Suitable for etching, NaOH, cleaning, and electroplating |
| Dielectric properties | Dk 3.19～3.24／Df 0.015 | Stable electrical transmission performance |
| High electrical reliability | CAF >1000 Hr／B-HAST >192 Hr | Long-term stability for high-reliability applications |
| Ultra-thin stack capability | Thickness adjustable from 10–30 μm | Ideal for ultra-thin substrates and miniaturized packages |
| Multi-substrate compatibility | Copper / Glass / Ceramic | Broad process compatibility without substrate limitations |
Why Choose Us?
See the Product Comparison
| Performance Metric | Microcosm Photosensitive MPBV | General Build-up Film | General Photoresist Material |
|---|---|---|---|
| High Resolution 30/30 μm | ✔ | ✘ | ▲ |
| Flexibility / Bendability | ✔ | ✘ | ✘ |
| Ultra-thin construction (10–30 μm） | ✔ | ✘ | ✔ |
| Thermal Resistance（320°C） | ✔ | ▲ | ✘ |
| Adhesion to Plated Cu | High | High | Low |
| Environmental reliability（85°C/85RH/1000hr） | High | Medium | Low |
| Suitable for SAP | Fully supported | Fully supported | Not supported |
| Suitable for HDI multilayer stacking | ✔ | ✔ | ✘ |
The Optimal Solution
MPBV photosensitive build-up PI integrates four critical advantages—high resolution, thermal resistance, reliability, and process compatibility—making it one of the most comprehensive material solutions available for HDI, SAP, mSAP, and fine-line circuit applications.
Product Application Process
