Photosensitive PSPI Designed for Precision Circuit Protection
Liquid Photo-Sensitive PSPI (Photo-Sensitive Polyimide) is a high-performance material specifically developed for ultra-flexible and thin circuit boards, insulation filling, and thick copper circuit structures.
It features excellent image resolution, outstanding chemical resistance, high heat resistance, superior flexibility, and low springback, making it ideal for fine openings, thick copper step filling, interlayer dielectrics in multilayer boards, and flexible bending module integration.
Two color options are available to meet different appearance and shielding requirements:
- Yellow PSPI (SLY00-G)*
- Black PSPI (SLB00-G)*
Common Challenges and Limitations
In FPC, PCB, thick copper boards, and module assembly, have you encountered the following challenges?
- Fine-line areas require high resolution while overall thickness must be reduced — but conventional materials cannot meet both needs
- Excessive springback force in bending modules, affecting assembly accuracy
- Difficulty achieving smooth planarization when filling thick copper height differences
Microcosm’s liquid photo-sensitive PSPI provides a comprehensive solution to the challenges mentioned above.
Product Advantages
Product Type：SLY00-GL / SLB00-GL
| Feature | Description | Product Values |
|---|---|---|
| Multiple color option |
|
Color flexibility: yellow offers good translucency for general substrates; black provides excellent light-blocking and visual concealment |
| High imaging resolution | 50 μm resolution | Stable development with sharp fine openings and line patterns |
| Excellent chemical resistance | Acid/ alkali resistant (10% HCl、NaOH） | No chemical erosion during wet processing |
| superior flexibility | High flexibility, low spring back | Ideal for bending modules and ultra-thin devices |
| High heat resistance | >320°C PASS | Supports high-temperature reflow processes |
| Bending durability | High bending reliability (R=0.15 >50 次 Load 500g） | Excellent static bending reliability |
| High electrical reliability | Ion migration resistance(85℃85%RH DC 50V >1000hr 35um/35um) | Suitable for long-lifetime, high-reliability products |
Why Choose Us?
See the Product Comparison
| Performance Metric | Microcosm Liquid Photo-Sensitive PSPI | Standard Solder Mask / CVL Materials |
|---|---|---|
| Ultra-fine imaging resolution | ★★★★☆（down to 50 µm） | ★★☆☆☆ (>100um) |
| Flexibility | ★★★★★ (Low spring back) | ★★☆☆☆（Relatively hard/brittle） |
| Ion migration resistance | ★★★★★（85℃85%RH >1000hr） | ★★☆☆☆ (<500hr) |
| Thick copper step filling | ≥100 μm achievable | Prone to cracking or voids |
| Heat resistance | No degradation above 320°C | Most solder masks < 260°C; Standard CVL~288°C |
The Optimal Solution
Liquid Photo-Sensitive PSPI leads the market in imaging precision, chemical resistance, flexibility, and heat resistance, making it the premium material of choice for ultra-thin circuit boards and thick copper insulation layers.
Product Application Structure
1. Ultra-Flexible / Ultra-Thin PCB Applications
• Thinned structural design products
• Low-rebound bending structure products
• All-in-one modules (CVL + PSR + Bending)
2. Insulation Filling / Thick Copper PCB Applications
• Automotive PCBs
• Power boards
• Multilayer thick copper structures
• Inter-line and inter-layer insulation layers
