High-Frequency & High-Speed Transmission Solutions
This product is a high-performance, high frequency adhesive film specifically developed for 5G high-speed FPC materials.
Featuring low dielectric constant (Dk) and low dielectric loss (Df), it functions as a protective adhesive layer that bonds seamlessly with various FCCL, copper foils, and insulating films.
Under high-frequency conditions, it delivers outstanding signal transmission performance and excellent dimensional stability.
Common Challenges and Limitations
In the age of 5G connectivity, are your devices suffering from severe high-frequency signal attenuation or increased electronic failure risks caused by ultra-fine circuit layouts?
- High-frequency signal loss: Conventional adhesives exhibit significant energy loss at high frequencies (e.g., above 10 GHz), resulting in degraded communication quality.
- Ion migration risk: High-density packaging reduces line spacing, while heat and humidity can trigger ion migration, leading to short circuits.
- Processing accuracy challenges: Insufficient material stability during lamination directly impacts impedance control precision.
Microcosm 5G High-Speed FPC Materials, with ultra-low dielectric loss and excellent ion migration resistance, effectively address high-frequency signal attenuation and reduce the risk of electronic failure.
Product Advantages
Product Type：AF* Series
| Feature | Technical Description | Product Value |
|---|---|---|
| High-frequency, low-loss performance | Dk 2.46 / Df 0.0015 (30GHz) | Optimizes 5G millimeter-wave transmission efficiency and enhances device data speeds |
| Anti-ion migration | 85°C/ 85%RH >1000 HR | Prevents electrochemical corrosion in fine-line circuits, extending product lifespan |
| Physical reliability | Standard water absorption: only 0.15% | Minimizes moisture impact on electrical performance and maintains signal stability |
| Processing advantages | Excellent dimensional stability | Improves layer-to-layer alignment accuracy and manufacturing yield |
Why Choose Us?
See the Product Comparison
| Performance Metric | Microcosm – AF* Series | General High-Frequency Adhesives |
|---|---|---|
| Dielectric loss (Df@30GHz) | 0.0015 (ultra-low loss) | Typically 0.003 – 0.005 |
| Ion migration resistance (HAST) | Passed 110°C/110 hrs | Difficult to maintain insulation under prolonged heat and humidity |
| Peel strength | > 1.5 Kgf/cm | Inconsistent performance |
The Optimal Solution
The AF* Series high-frequency adhesive not only leads in electrical performance but also provides robust physical and electrical protection for 5G devices through its low moisture absorption and superior anti-ion-migration technology.
High-Frequency Low-Loss Material Test Report
