NEWS & EVENTS
SEMICON Taiwan 2026 Exhibition Highlights
Exhibition Highlights
Microcosm Technology Co., Ltd. participated in SEMICON Taiwan 2026 from September 2 to 4, 2026, showcasing high-performance electronic materials and related process applications at Booth L1105 in Taipei Nangang Exhibition Center, Hall 1.
The exhibition featured peelable PSPI, photosensitive PSPI, P-PSPBO, materials for TGV and glass-core applications, PTFE, and transparent polyimide. During the event, our team exchanged insights with industry partners on material and process requirements for PCB/FPC, advanced packaging, optical communications, and high-frequency, high-speed applications.
Featured Technologies and Materials
Peelable PSPI
Combining photo-patternability with high-temperature process resistance, this material withstands process temperatures above 230°C and can be cleanly removed with an alkaline solution after processing. It is suited for localized temporary protection in cavity, silicon bridge, and advanced packaging processes.
Liquid & Film-Type Photosensitive PSPI
Liquid- and film-type photosensitive PSPI provides high heat resistance above 320°C, high flexibility, low springback, and excellent gap-filling capability. It can consolidate multi-material processes, improve surface planarity, and support thinner FPC/PCB modules.
P-PSPBO
A positive-tone photosensitive PBO with low dielectric loss, high resolution, and low moisture absorption, with Df below 0.007. Designed for VCSEL packaging and high-speed optical communications, it supports high-bandwidth, high-speed signal transmission.
TGV Stress Buffer Material
Designed for TGV laser-drilling processes, this stress-buffer material helps reduce stress concentration and suppress glass microcracking, supporting improved process yield and reliability for glass-core and glass-interposer applications.
PTFE
An ultra-low-loss, high-frequency material with Dk 2.84 and Df 0.0005, offering excellent thermal stability and chemical reliability. It is suited for high-frequency, high-speed applications including AI servers, 800G/1.6T/3.2T, high-speed optical communications, and RF.
Transparent Polyimide
A transparent polyimide material offering light transmittance above 90%, low yellowness, heat resistance, and high reliability. The portfolio includes low-retardation, high-flexibility, and high-modulus films, as well as customized PI varnishes for foldable displays, AR/VR, optical films, and flexible devices.
Exhibition Highlights and Technical Exchange
During the exhibition, the Microcosm team exchanged insights with industry partners on high-temperature process protection, photosensitive materials, PCB/FPC, advanced packaging, optical communications, and high-frequency, high-speed material and process requirements. Discussions also covered material selection and process-integration approaches for different application scenarios.
PTFE
Physical PTFE samples were displayed on site, highlighting applications in high-frequency, high-speed communications.
