FPCB / PCB Material

Our recent projects

Photosensitive High-Temperature Peelable PI
BRINA™ Photosensitive Dielectric Material
High-Reliability Yellow Coverlay Film
Flexible PCB Materials
Adhesive-Based 3-Layer Flexible Copper Clad Laminate (FCCL)
Flexible PCB Materials
Liquid Photo-Sensitive PSPI
BRINA™ Photosensitive Dielectric Material
Adhesive-Based Single-Sided Flexible Copper Clad Laminate (FCCL)
Flexible PCB Materials
Bonding Sheet Adhesive Series
Flexible PCB Materials
5G High-Speed FPC Materials
5G High-Speed FPC Materials
FMBF Flexible Build-up Film
Build-up Materials
MPBV Liquid Photosensitive Build-up PI
Build-up Materials

Rooted in Southern Taiwan Science Park
We are Connecting Globally

Display Materials
Mpior™ Transparent Polyimide, Transparent Polyimide Resine
Semiconductor Materials
BRINA™ Photoimageable Dielectric Material
Ion Exchange Membranes
Anion Exchange Membrane (for Hydrogen Production), Proton Exchange Membrane (for Flow Battery Applications)
FPCB / PCB Materials
BRINA™ Photoimageable Dielectric Material, 5G High-Speed FPC Materials, Build-Up Materials, Flexible PCB Materials

+886-6-5050662

● Email: sales@microcosm.com.tw
● Taiwan Headquarters: No. 8, Nanke 9th Road, Shanhua District, Tainan City, Taiwan (ROC)
● China Suzhou Plant: No. 45, Suhong Middle Road, Suzhou Industrial Park, Jiangsu Province, China

💡 Contact Us

From product inquiries to global partnerships, our team delivers prompt, precise, and tailored support to meet your needs.

FPCB / PCB Material

Our recent projects

Photosensitive High-Temperature Peelable PI

High-Reliability Yellow Coverlay Film

Adhesive-Based 3-Layer Flexible Copper Clad Laminate (FCCL)

Liquid Photo-Sensitive PSPI

Adhesive-Based Single-Sided Flexible Copper Clad Laminate (FCCL)

Bonding Sheet Adhesive Series

5G High-Speed FPC Materials

FMBF Flexible Build-up Film

MPBV Liquid Photosensitive Build-up PI

Rooted in Southern Taiwan Science Park We are Connecting Globally

Rooted in Southern Taiwan Science Park
We are Connecting Globally