Photosensitive Dielectric Material for Optical Communication VCSEL and RDL Applications
Microcosm P-PSPBO Photosensitive Dielectric Material is a high-performance photosensitive dielectric material specifically designed for VCSEL device packaging, RDL (Redistribution Layer) processes, and high-speed optical communication modules.
It features ultra-low dielectric loss , stable low Dk, high lithographic resolution, a PFAS-free formulation, and low-temperature curing.
Common Challenges and Limitations
With the rapid development of 5G, AI, high speed transmission (25G/50G/100G+), VCSEL, and advanced packaging technologies (RDL & FO-WLP), dielectric materials are facing increasingly stringent requirements:
- Ultra-low signal loss
- Finer lithographic resolution
- Process temperatures compatible with multilayer stacking and diverse substrates
Microcosm P-PSPBO Photosensitive Dielectric Material is engineered to solve all of these challenges.
Product Advantages
| Feature | Description | Product Benefits |
|---|---|---|
| Low Df | ＜0.008@10GHz | Minimizes signal loss, improves jitter and eye-pattern quality |
| Low Dk | ＜3 | Enhances high-speed transmission efficiency and module stability |
| PFAS-Free | – | Complies with EU/US environmental regulations and reduces future compliance risk |
| Lithographic resolution | 5/5 μm、15/15 μm | Supports fine-line advanced RDL and VCSEL structures |
| Low-temperature curing | <230°C | Compatible with multilayer stacking, reducing thermal stress |
| Taper Angle | >70–81° | Improves via profile and metal filling success rate |
| High reliability | Breakdown >5KV, high elongation | Extends device lifetime and reduces failure rates |
| Broad applicability | VCSEL、RDL、optical modules | One material for multiple processes, reducing integration cost |
The Optimal Solution
P-PSPBO is purpose-built for next-generation high-speed communication and advanced packaging, delivering overwhelming performance advantages.
Product Application Structure
25G VCSEL Optical Communication Transceiver
5G / AI High-Speed Data Transmission Modules
