Photosensitive High-Temperature Peelable PI

Dedicated for Cavity / Through-Hole /
Optical Module Burr Protection & PP/AD Window Blocking
No Cracking at High Temperature ·
No Residue After Processing · High-Precision Imaging
A stable, controllable, and fully removable protection material

Zero-Residue Protective Adhesive Designed for Open-Cover Processes

Photosensitive High-Temperature Peelable PI is a high-performance protection material specifically developed for cavity step openings, through-hole protection, optical module burr suppression, and PP/AD window blocking processes.

It features high-resolution image patterning, no cracking at process temperatures up to 230°C, clean alkaline peeling with no residue, and controllable step-filling capability.

The material supports screen-print thicknesses from 20 to 150 μm, adapting to a wide range of processing requirements. It is non-reactive with PP substrates and can be completely removed, significantly improving process stability and manufacturing yield.

Common Challenges and Limitations

In precision PCB fabrication, cavity structures, 3D stepped boards, optical modules, and substrate manufacturing, do you often encounter the following issues?

Protective films (peelable coatings or PI tapes) crack or leave residue after high-temperature lamination, requiring rework
Residual adhesive after peeling is difficult to remove, affecting downstream processes and long-term reliability
Irregular blocking edges and excessive burr formation lead to yield loss
Small pad openings combined with excessive PP/AD resin flow make adhesive control difficult
Fine-line areas require high resolution while overall thickness must be reduced, but conventional materials cannot meet both needs
Excessive rebound force in bending modules negatively impacts overall assembly
Poor planarization control in multilayer cavity structures with large step heights

Microcosm’s Photosensitive High-Temperature Peelable PI provides a complete solution to the challenges listed above.

Product Advantages

Feature	Description	Product Values
Screen-print thickness	20–150 μm	Wide thickness adaptability improves process flexibility and surface planarization
Pre-bake temperature	75–90°C	Lower processing temperature improves substrate safety
Imaging resolution	100 μm	High imaging precision ensures clean and well-defined small openings
High-temperature resistance	230°C without cracking	No cracking risk during high-temperature baking or reflow
Peeling time	3–5 mins (NaOH 4% 50°C )	Clean removal without substrate damage or residue

Why Choose Us?
See the Product Comparison

Performance Metric	Microcosm Photosensitive High-Temperature Peelable PI	Standard Peelable Materials
High-temperature resistance	★★★★☆（No cracking at 230°C ）	★★☆☆☆ (Prone to cracking)
Residue control	★★★★★ (Residue-free)	★★☆☆☆（Residual adhesive）
Imaging resolution	★★★★★（Stable fine-area patterning）	☆☆☆☆☆ (Non-photosensitive)
Thickness adaptability	20-150 μm	Limited to thick films
PP/AD compatibility	Non-reactive, controlled resin overflow	Poor control, prone to residue

The Optimal Solution

The SLY00-PU series outperforms comparable materials in thermal resistance, imaging precision and clean peelability, significantly improving process stability and yield. Photosensitive High-Temperature Peelable PI is the ideal solution for cavity and stepped boards (stepped gold fingers, stepped vertical power planes), optical modules, and advanced substrate manufacturing.