Microcosm Technology will participate in HKPCA 2026 — the International Electronics Circuit Exhibition (Shenzhen), from December 2 to 4, 2026, at the Shenzhen World Exhibition & Convention Center (Bao’an). Visit us at Booth 8G32 to explore high-performance material solutions for PCB/FPCB and advanced electronics manufacturing.
Advanced Materials for PCB/FPCB and Electronics Manufacturing
As electronic devices move toward higher interconnection density, lighter and thinner designs, and greater reliability, material performance plays an increasingly important role in manufacturing. Microcosm Technology continues to develop functional polyimide and high-performance materials for a wide range of process requirements.
At HKPCA 2026, we will highlight four key material technologies and their applications:
- Photosensitive Polyimide (PSPI): For fine-pattern processing, circuit protection, and high-reliability electronic material applications.
- Liquid Photosensitive Build-up Material (MPBV): A liquid material solution for high-density interconnects and advanced build-up processes.
- Film-type Build-up Dielectric Material (FMBF): A film-based dielectric material option for high-density circuit fabrication.
- Alkali-soluble Peelable PI Series: For high-temperature processing, localized protection, and temporary protection applications that require material removal.
- PTFE High-performance Materials: Additional material solutions for high-frequency and high-speed electronics, where low dielectric loss is important.
HKPCA 2026 Exhibition Details
- Dates: December 2–4, 2026
- Venue: Shenzhen World Exhibition & Convention Center (Bao’an), Shenzhen, China
- Microcosm Booth: 8G32
Booth Location Map
We Look Forward to Meeting You
We warmly invite customers, industry professionals, and partners to visit Booth 8G32 to discuss material technologies, process requirements, and potential collaboration opportunities.
We look forward to seeing you at HKPCA 2026!
